Development of Wire Mesh Copper Alloy C45470 ^|^ldquo;UR30ST^|^rdquo; for Aquaculture
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چکیده
منابع مشابه
Wire bonding using copper wire
Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
متن کاملOverview of wire bonding using copper wire or insulated wire
Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...
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We present an interactive method for mesh segmentation that is inspired by the classical live-wire interaction for image segmentation. The core contribution of the work is the definition and computation of wires on surfaces that are likely to lie at segment boundaries. We define wires as geodesics in a new tensor-based anisotropic metric, which improves upon previous metrics in stability and fe...
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We have investigated the electromagnetic properties of a 3D wire mesh in a geometry resembling covalently bonded diamond. The frequency and wave vector dispersion show forbidden bands at those frequencies n0, corresponding to the lattice spacing, just as dielectric photonic crystals do. But they have a new forbidden band which commences at zero frequency and extends, in our geometry, to , 12 n0...
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ژورنال
عنوان ژورنال: Materia Japan
سال: 2013
ISSN: 1340-2625
DOI: 10.2320/materia.52.122